About Us

DAEDALUS Advanced Hardware Design
CORE ARCHITECTURE
CRAFTING THE FUTURE OF ELECTRONICS

WHERE COMPLEXITY
MEETS ELEGANCE IN
HARDWARE DESIGN.

At DAEDALUS, we regard every circuit design as a masterpiece of precision engineering. By simplifying complex engineering challenges, we transform ambitious microcircuit concepts into reality through a standardized, high-precision workflow.

WHO WE ARE

Daedalus Design Co., Ltd. is a specialized PCB design engineering company providing professional PCB layout services and hardware engineering support for customers worldwide.

Our engineering team consists of experienced PCB design professionals with extensive hands-on experience in supporting complex hardware development projects across networking, semiconductor, industrial, embedded, telecommunications, and high-performance computing applications.

Before the establishment of Daedalus Design, our engineers built their careers within established engineering organizations, contributing to projects for leading international customers, particularly in Japan and the United States. This experience has shaped our engineering discipline, technical expertise, and commitment to delivering reliable, manufacturable, and high-quality PCB layouts.

Rather than operating as a traditional design house, we serve as a flexible engineering extension of our customers’ hardware teams. We collaborate closely with electrical engineers throughout the PCB layout process, helping accelerate product development while maintaining design quality, schedule commitment, and effective communication.

TRACK RECORD & CLIENTELE

INDUSTRY EXPERIENCE & CUSTOMER EXPOSURE

01 // OVERVIEW

Throughout their careers, our engineers have contributed to projects supporting customers across semiconductor, networking, storage, industrial, telecommunications, and embedded technology sectors.

02 // REPRESENTATIVE ORGANIZATIONS

Projects were supported by members of our engineering team across key global technology markets:

UNITED STATES
  • Cisco
  • Intel
  • Altera
  • Broadcom
  • Pure Storage
  • KLA
  • cPacket
JAPAN
  • Toshiba
  • P-Ban
  • Other Japanese electronics manufacturers
03 // CONFIDENTIALITY & EXCELLENCE

Many projects remain subject to customer confidentiality agreements.

However, these experiences provided our engineers with exposure to advanced product development environments, strict engineering standards, and highly demanding PCB design challenges.

CULTURE // CORE_VALUES

OUR PROFESSIONAL DNA

At Daedalus Design, we believe engineering quality is shaped by the environments in which engineers grow.

GLOBAL BENCHMARKS

Our team members were trained through years of collaboration with demanding international customers, particularly in Japan and the United States, where:

Precision
Accountability
Documentation Quality
Schedule Commitment
…are essential.
ENGINEERING CULTURE

As a result, we bring not only PCB layout capability, but also an engineering culture built around professionalism, responsiveness, and long-term customer success.

ENGINEERING SPECIFICATIONS

TECHNICAL CAPABILITIES

01 // DOMAIN

PCB DESIGN

  • Multilayer PCB Layout
  • High-Density BGA Fanout
  • High-Speed Digital Design
  • Mixed-Signal PCB Design
  • Industrial Electronics
  • Embedded Systems
  • Networking Equipment
  • RF PCB Design
02 // ARCHITECTURE

HIGH-SPEED INTERFACES

  • DDR Memory
  • PCI Express
  • Ethernet
  • SATA
  • SGMII
  • USB
  • Differential Pair Routing
  • Controlled Impedance Routing
03 // ASSURANCE

DESIGN QUALITY

  • DFM Awareness
  • DFA Awareness
  • Signal Integrity Conscious Layout
  • EMI / EMC Conscious Layout
  • Manufacturing Documentation Support
04 // SOFTWARE STACK

TOOLS

  • Cadence Allegro
  • Altium Designer
  • KiCad
  • Customer-Specified EDA Environments
SYSTEM METRICS // HARDWARE OVERVIEW

TECHNICAL CAPABILITY SNAPSHOT

UP TO 22
Layers Stackup PCB Designs
1400+
Components per Board
9000+
Vias per Design
MEMORY ARCHITECTURE DDR3 / DDR4 Experience
HIGH SPEED INTERFACE PCIe Experience
NETWORKING DATA RATE 100G Ethernet Experience
PROCESSING PLATFORMS FPGA / SoC Platforms
ADVANCED VIA TECHNOLOGY Blind / Buried Via Technology
SIGNAL INTEGRITY FABRICATION Backdrill Technology
ROUTING PRECISION Controlled Impedance Routing
HIGH-DENSITY LAYOUT High-Density BGA Fanout

Engineering Excellence

A rigorous execution framework powered by advanced EDA methodologies and uncompromising quality assurance standards.

Design Process & Quality Control

01

Requirement Review

Comprehensive analysis of system specifications, electrical constraints, and target operational conditions.

02

Constraint Definition

Establishing strict design rules for high-speed signals, stackup planning, and thermal dissipation thresholds.

03

PCB Layout

Precision component placement and multi-layer impedance-matched trace routing via advanced EDA CAD software.

04

Engineering Review

Rigorous peer-level schematic cross-probing, Signal Integrity (SI), and Power Integrity (PI) simulation reviews.

05

DFM Verification

Automated Design for Manufacturability & Assembly checks eliminating fabrication risks before production.

06

Manufacturing Release

Final generation of IPC-compliant Gerber RS-274X files, ODB++, drill matrices, and complete fabrication data packages.