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OUR WORK / PORTFOLIOREPRESENTATIVE PROJECT
PROJECT 01
100G Embedded Optics Network Line Card
Detailed Information
- 100G Ethernet (CAUI/XLAUI)
- PCIe Interconnect
- 18-Layer High-Speed PCB
- Blind & Buried Via Technology
- Backdrilling
- Controlled Impedance Routing
- High-Density BGA Fanout
- 18 layers stackup
- 1502 components
- 1495 nets
- 8051 vias
PROJECT 02
FPGA/SoC Development Platform
Detailed Information
- Intel Cyclone V SoC FPGA
- ARM Cortex-A9 HPS
- DDR3 SDRAM
- Gigabit Ethernet
- USB 2.0 OTG
- SD Card Interface
- VGA Output
- Audio Codec Interface
- HSMC Expansion Interface
- JTAG Debug Interface
- 12 layers stackup
- 1162 components
- 924 nets
- 3697 vias
PROJECT 03
High-Density 10G/40G Ethernet Switching Platform for Enterprise and Data Center Networking.
Detailed Information
- Multi-ASIC Architecture (BigSur & Pacifica)
- High-Speed PCIe Fabric
- Multi-Channel DDR3 ECC Memory Interface
- 48-Port 10G Ethernet PHY Integration
- QSFP Optical Connectivity
- Controlled Impedance Routing
- High-Density BGA Breakout
- Blind & Buried Via Technology
- Backdrilling for High-Speed SerDes Channels
- 22 layers stackup
- 14460 components
- 8326 nets
- 42377 vias
PROJECT 04
High-Speed Ethernet Switching Platform
Detailed Information
- 18-Layer High-Speed PCB
- Multi-ASIC Architecture
- DDR Memory Interface
- PCIe Interconnect
- High-Speed SerDes Routing
- Controlled Impedance Design
- Blind & Buried Vias
- Backdrilling
- High-Density BGA Fanout
- Signal Integrity Optimization
- Power Integrity Optimization
- 18 layers stackup
- 8463 components
- 6808 nets
- 27837 vias
