Detailed Information
- 18-Layer High-Speed PCB
- Multi-ASIC Architecture
- DDR Memory Interface
- PCIe Interconnect
- High-Speed SerDes Routing
- Controlled Impedance Design
- Blind & Buried Vias
- Backdrilling
- High-Density BGA Fanout
- Signal Integrity Optimization
- Power Integrity Optimization
- 18 layers stackup
- 8463 components
- 6808 nets
- 27837 vias
